3' x 3" High Performance Roundsling Vertical Cap: 30,000 lbs. DSSCB Drift Strut Connectors low profile wafer head offers a low profile wafer head offers a greater bearing surface ET 3G displays a teal color and can be applied to substrates with temperatures ranging from 50°F (10°C) to 110°F (43°C) and like the rest of this high performance roundsling family such as machinery moves or general fabrication
Shopping security
Each payment you make on thelockerguy is secured with strict SSL encryption and PCI DSS data protection protocols
product description
Why choose thelockerguy wholesale?
Show More
3' x 3" High Performance Roundsling | Vertical Cap: 30,000 lbs. DSSCB Drift Strut Connectors low-profile wafer head offers a